Senior Mechanical Engineer

About Solinide Photonics

Solinide Photonics designs the photonic ICs that will power the next generation of AI and cloud infrastructure. Our flagship programme is an external laser source delivered in the OIF ELSFP (External Laser Small Form-factor Pluggable) form factor, a field-replaceable module that feeds optical power to co-packaged optics in switches, NICs, and AI accelerators. We are building an ultra power-efficient design, because the power a laser source wastes is power an AI datacentre then has to feed and cool, so efficiency sits at the heart of both our product and the case for more sustainable datacentres. The mechanical and thermal design of these modules is mission-critical: every degree of junction temperature and every micrometre of fibre alignment shows up in the performance budget.

About the Role

We are looking for a Senior Mechanical Engineer, as an employee or on a consultant basis, to lead the mechanical and thermal design of our ELSFP package and follow-on products. You will take requirements from optical, electrical, and reliability engineers and turn them into a manufacturable module, from concept sketches through detailed 3D CAD and thermal simulation to prototype builds and qualification. Because the modules must hit an aggressive power-efficiency target, your thermal and packaging design is central to how efficient, and how sustainable, the product can be. You will work closely with our optical and electronics teams and be the technical interface to our contract manufacturers.

This is a hands-on senior role, open to employees and consultants, with broad ownership of the mechanical platform and scope to grow into technical leadership as the team scales.

What You Will Do

• Mechanical design ownership: lead the mechanical design of ELSFP modules and supporting fixtures from concept through to production release, working in close partnership with optical and electronics engineers.
• Detailed product drawings: produce production-ready 3D CAD models and 2D drawings with full GD&T, BOMs, and tolerance stacks (SolidWorks, Creo, or NX).
• Thermal simulation and design: build and run thermal and thermo-mechanical models (ANSYS Icepak, FloTHERM, or similar); define heat-spreader, TEC, and airflow strategies to keep laser junction temperatures inside spec.
• Cross-discipline thermal work: partner with the electrical team on power dissipation and TEC strategy, co-designing packaging and electronics to hit the thermal and efficiency budget together.
• Structural / FEA analysis: perform linear and nonlinear FEA for shock, vibration, drop, and mating-force studies; correlate models with measurements.
• DFM / DFA with suppliers: drive design-for-manufacture reviews with precision-machining, die-cast, and PCB suppliers; lead the mechanical side of NPI.
• Material and process selection: choose materials, finishes, optical epoxies, and seals appropriate for non-hermetic optoelectronic packaging.
• Prototype build and validation: spend time on the lab floor supervising prototype builds, instrumenting modules for thermal and mechanical tests, and closing the loop with simulation.
• Standards and compliance: ensure designs meet OIF ELSFP mechanical interfaces, GR-468 / Telcordia reliability expectations, and relevant EMI/EMC requirements.
• Mentorship: coach junior engineers and technicians, and help establish mechanical design standards and review practices in the team.

What We Are Looking For

Required

• MSc in Mechanical Engineering, Engineering Physics, or equivalent (Swedish civilingenjör or international equivalent).
• Typically 7+ years of mechanical design experience on small form-factor electronic or optoelectronic products, or equivalent depth.
• Deep experience with 3D CAD (SolidWorks preferred; Creo or NX also acceptable) and GD&T.
• Experience with thermal simulation (ANSYS Icepak, FloTHERM, 6SigmaET, or similar).
• Experience taking a mechanical design from concept to qualified production.
• Fluent in written and spoken English.
• Eligible to work in Sweden.

Strongly Preferred

• Direct experience with pluggable optical transceivers (SFP, QSFP-DD, OSFP, CPO) or ELSFP.
• Knowledge of optical packaging: fibre routing, alignment tolerances, optical epoxies, hermetic and non-hermetic sealing, TECs.
• Familiarity with high-speed electronics packaging and signal-integrity-aware mechanical layout.
• Experience with shock, vibration, drop, mating-force, and thermal-cycling qualification.
• Structural FEA experience (linear and nonlinear) for shock, vibration, drop, and mating-force studies.
• Experience taking designs into volume production with a contract manufacturer (NPI / production transfer).
• Interest in thermal and packaging design for energy-efficient, sustainable hardware.
• Working knowledge of Swedish.

Not sure you tick every box? If the work excites you, send your application anyway, we’d genuinely love to see it.

What We Offer

• Competitive compensation as an employee salary or consultant rate; occupational pension, 30 days' vacation, and wellness allowance (friskvårdsbidrag) for employees.
• Flexible hours, hybrid working, and genuine support for parental leave and work-life balance.
• A close, technically strong team and a real chance to shape both the products and the engineering culture.